Vaccum Soldering Systems

  • Voids will be reduced up to 99%, solder joints quality optimized
  • Double sided PCBs
  • Suitable for PCBs, DCB, stamping grid and carrier
  • Setting Parameter: evacuation time; vacuum hold time; ventilation time; vacuum pressure
  • Only one sealing surface of the vacuum chamber
Vacuum S

Heating zone 2598 mm

Vacuum M

Process area lenght 4326 mm

Vacuum L

Process area lenght 5432 mm

Vacuum L Plus

Precess area lenght 6392 mm